The Advanced Manufacturing Process of Flexible PCBs

Flexible Printed Circuits (FPCs) require highly precise engineering environments and sophisticated workflows. Below are the standard manufacturing standard operating procedures (SOP) for both double-sided and single-sided flexible PCBs.

1. Double-Sided FPC Manufacturing Process

Phase 1: Base Preparation & Via Hole Creation

Material Cutting →rightarrow→ Drilling →rightarrow→ PTH (Plated Through Hole) →rightarrow→ Panel Plating

Phase 2: Inner Layer Patterning (First Side)

Pretreatment →rightarrow→ Dry Film Lamination →rightarrow→ Alignment →rightarrow→ Exposure →rightarrow→ Development →rightarrow→ Pattern Plating →rightarrow→ Film Stripping

Phase 3: Outer Layer Patterning & Etching (Second Side)

Pretreatment →rightarrow→ Dry Film Lamination →rightarrow→ Alignment & Exposure →rightarrow→ Development →rightarrow→ Etching →rightarrow→ Film Stripping

Phase 4: Surface Protection & Finishing

Surface Treatment →rightarrow→ Coverlay Lamination →rightarrow→ Pressing →rightarrow→ Curing →rightarrow→ Surface Finishing (ENIG/Plating) →rightarrow→ Silkscreen Printing

Phase 5: Fabrication, Final Inspection & Shipping

Shearing →rightarrow→ Electrical Testing (E-Test) →rightarrow→ Punching & Die Cutting →rightarrow→ Final Inspection (FQC) →rightarrow→ Packaging →rightarrow→ Shipment

2. Single-Sided FPC Manufacturing Process

Step 1: Cutting →rightarrow→ Drilling →rightarrow→ Pretreatment

Step 2: Dry Film Lamination →rightarrow→ Alignment →rightarrow→ Exposure →rightarrow→ Development

Step 3: Etching →rightarrow→ Film Stripping →rightarrow→ Pretreatment

Step 4: Coverlay Lamination →rightarrow→ Pressing →rightarrow→ Curing

Step 5: Surface Finishing (ENIG/Plating) →rightarrow→ Silkscreen Printing →rightarrow→ Shearing

Step 6: Electrical Testing (E-Test) →rightarrow→ Punching & Outline Cutting rightarrow→ Final Inspection →rightarrow→ Packaging →rightarrow→ Shipment